HP KC.32101.DMP Datasheet Page 59

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Datasheet, Volume 1 59
Power Management
It is important to understand that since the power down decision is per rank, the MC
can find a lot of opportunities to power down ranks, even while running memory
intensive applications; savings may be significant (up to a few Watts, depending on
DDR configuration). This becomes more significant when each channel is populated
with more ranks.
Selection of power modes should be according to power performance or thermal trade-
offs of a given system:
When trying to achieve maximum performance and power or thermal consideration
is a non-issue, use no power down.
In a system that tries to minimize power-consumption, try to use the deepest
power down mode possible – DLL-off or APD_DLLoff.
In high-performance systems with dense packaging (that is, tricky thermal design)
the power down mode should be considered in order to reduce the heating and
avoid DDR throttling caused by the heating.
Control of the power-mode through CRB-BIOS: BIOS selects by default no-power
down.
Another control is the idle timer expiration count. This is set through PM_PDWN_config
bits 7:0 (MCHBAR +4CB0). As this timer is set to a shorter time, the IMC will have
more opportunities to put DDR in power down. The minimum recommended value for
this register is 15. There is no BIOS hook to set this register. Customers who choose to
change the value of this register can do it by changing the BIOS. For experiments, this
register can be modified in real time if BIOS did not lock the MC registers.
Note: In APD, APD-PPD, and APD-DLLoff there is no point in setting the idle counter in the
same range of page-close idle timer.
Another option associated with CKE power down is the S_DLL-off. When this option is
enabled, the SBR I/O slave DLLs go off when all channel ranks are in power down. (Do
not confuse it with the DLL-off mode, in which the DDR DLLs are off). This mode
requires an I/O slave DLL wakeup time be defined.
4.3.2.1 Initialization Role of CKE
During power-up, CKE is the only input to the SDRAM that has its level recognized
(other than the DDR3 reset pin) once power is applied. The signal must be driven LOW
by the DDR controller to make sure the SDRAM components float DQ and DQS during
power-up. CKE signals remain LOW (while any reset is active) until the BIOS writes to a
configuration register. Using this method, CKE is ensured to remain inactive for much
longer than the specified 200 μs after power and clocks to SDRAM devices are stable.
4.3.2.2 Conditional Self-Refresh
Intel Rapid Memory Power Management (Intel RMPM) conditionally places memory into
self-refresh in the package C3, C6, and C7 low-power states. RMPM functionality
depends on graphics/display state (relevant only when processor graphics is being
used), as well as memory traffic patterns generated by other connected I/O devices.
When entering the S3 - Suspend-to-RAM (STR) state or S0 conditional self-refresh, the
processor core flushes pending cycles and then enters all SDRAM ranks into self
refresh. the CKE signals remain LOW so the SDRAM devices perform self-refresh.
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