HP KC.32101.DMP Datasheet Page 5

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Datasheet, Volume 1 5
4.2.4.4 Core C6 State........................................................................... 53
4.2.4.5 Core C7 State........................................................................... 54
4.2.4.6 C-State Auto-Demotion ............................................................. 54
4.2.5 Package C-States ................................................................................... 54
4.2.5.1 Package C0.............................................................................. 56
4.2.5.2 Package C1/C1E ....................................................................... 56
4.2.5.3 Package C3 State...................................................................... 56
4.2.5.4 Package C6 State...................................................................... 56
4.2.5.5 Package C7 State...................................................................... 57
4.2.5.6 Dynamic L3 Cache Sizing ........................................................... 57
4.3 IMC Power Management..................................................................................... 57
4.3.1 Disabling Unused System Memory Outputs ................................................ 57
4.3.2 DRAM Power Management and Initialization ............................................... 58
4.3.2.1 Initialization Role of CKE............................................................ 59
4.3.2.2 Conditional Self-Refresh ............................................................ 59
4.3.2.3 Dynamic Power Down Operation ................................................. 60
4.3.2.4 DRAM I/O Power Management .................................................... 60
4.3.3 DDR Electrical Power Gating (EPG) ........................................................... 60
4.4 PCI Express* Power Management ........................................................................ 61
4.5 DMI Power Management..................................................................................... 61
4.6 Graphics Power Management .............................................................................. 61
4.6.1 Intel
®
Rapid Memory Power Management (RMPM) (also known as CxSR) ....... 61
4.6.2 Intel
®
Graphics Performance Modulation Technology (GPMT) ....................... 61
4.6.3 Graphics Render C-State ......................................................................... 62
4.6.4 Intel
®
Smart 2D Display Technology (Intel
®
S2DDT) .................................. 62
4.6.5 Intel
®
Graphics Dynamic Frequency.......................................................... 62
4.6.6 Display Power Savings Technology 6.0 (DPST) ........................................... 63
4.6.7 Automatic Display Brightness (ADB) ......................................................... 63
4.6.8 Seamless Display Refresh Rate Switching Technology (SDRRST)................... 63
4.7 Graphics Thermal Power Management.................................................................. 64
5 Thermal Management .............................................................................................. 65
5.1 Thermal Considerations...................................................................................... 65
5.2 Intel
®
Turbo Boost Technology Power Monitoring................................................... 65
5.3 Intel
®
Turbo Boost Technology Power Control ....................................................... 66
5.3.1 Package Power Control............................................................................ 66
5.3.2 Power Plane Control................................................................................ 68
5.3.3 Turbo Time Parameter ............................................................................ 68
5.4 Configurable TDP and Low Power Mode ................................................................ 68
5.4.1 Configurable TDP ................................................................................... 68
5.4.2 Low Power Mode .................................................................................... 69
5.5 Thermal and Power Specifications........................................................................ 70
5.6 Thermal Management Features ........................................................................... 73
5.6.1 Adaptive Thermal Monitor........................................................................ 73
5.6.1.1 TCC Activation Offset ................................................................ 74
5.6.1.2 Frequency/Voltage Control ......................................................... 74
5.6.1.3 Clock Modulation ...................................................................... 76
5.6.2 Digital Thermal Sensor............................................................................ 76
5.6.2.1 Digital Thermal Sensor Accuracy (Taccuracy)................................ 77
5.6.2.2 Fan Speed Control with Digital Thermal Sensor ............................. 77
5.6.3 PROCHOT# Signal .................................................................................. 77
5.6.3.1 Bi-Directional PROCHOT# .......................................................... 77
5.6.3.2 Voltage Regulator Protection versus PROCHOT#............................ 78
5.6.3.3 Thermal Solution Design and PROCHOT# Behavior ........................ 78
5.6.3.4 Low-Power States and PROCHOT# Behavior ................................. 78
5.6.3.5 THERMTRIP# Signal .................................................................. 79
5.6.3.6 Critical Temperature Detection ................................................... 79
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