HP dx5150 Technical Information download pdf (Page 53)

Service Reference Guide, dx5150 361685-001 5–3

Identifying the Chassis, Routine Care, and Disassembly Preparation

5.2.1 Generating Static

The following table shows that:

■ Different activities generate different amounts of static electricity.

■ Static electricity increases as humidity decreases.

✎

700 volts can degrade a product.

5.2.2 Preventing Electrostatic Damage to Equipment

Many electronic components are sensitive to ESD. Circuitry design and structure determine the

degree of sensitivity. The following packaging and grounding precautions are necessary to

prevent damage to electric components and accessories.

■ To avoid hand contact, transport products in static-safe containers such as tubes, bags, or

boxes.

■ Protect all electrostatic parts and assemblies with conductive or approved containers or

packaging.

■ Keep electrostatic sensitive parts in their containers until they arrive at static-free stations.

■ Place items on a grounded surface before removing them from their container.

■ Always be properly grounded when touching a sensitive component or assembly.

■ Avoid contact with pins, leads, or circuitry.

■ Place reusable electrostatic-sensitive parts from assemblies in protective packaging or

conductive foam.

5.2.3 Personal Grounding Methods and Equipment

Use the following equipment to prevent static electricity damage to equipment:

■ Wrist straps are flexible straps with a maximum of one-megohm ± 10% resistance in the

ground cords. To provide proper ground, you must wear a strap snug against bare skin. The

ground cord must be connected and fit snugly into the banana plug connector on the

grounding mat or workstation.

Relative Humidity

Event 55% 40% 10%

Walking across carpet

Walking across vinyl floor

Motions of bench worker

Removing DIPs* from plastic tube

7, 5 0 0 V

3,000 V

400 V

15,000 V

5,000 V

800 V

700 V

35,000 V

12,000 V

6,000 V

2,000 V

Removing DIPs* from vinyl tray

Removing DIPs* from Styrofoam

Removing bubble pack from PCB

Packing PCBs in foam-lined box

2,000 V

3,500 V

7,000 V

5,000 V

4,000 V

5,000 V

20,000 V

11,000 V

11,500 V

14,500 V

26,500 V

21,000 V

*These components are multi-packaged inside plastic tubes, trays, or Styrofoam.

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HP dx5150 Technical Information Page 53

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