HP dx5150 Technical Information download pdf (Page 101)

Service Reference Guide, dx5150 361685-001 7–7

Removal and Replacement Procedures— Small Form Factor (SFF) Chassis

7.6 Memory Modules

CAUTION: The memory module sockets have gold metal contacts. When upgrading the memory, it is

important to use memory modules with gold metal contacts to prevent corrosion and/or oxidation

resulting from having incompatible metals in contact with each other.

CAUTION: Static electricity can damage the electronic components of the computer or optional cards.

Before beginning these procedures, ensure that you discharge yourself of static electricity by briefly

touching a grounded metal object. Refer to

Chapter 5, “Identifying the Chassis, Routine Care, and

Disassembly Preparation,” for more information.

CAUTION: When handling a memory module, be careful not to touch any of the contacts. Doing so

may damage the module.

1. Prepare the computer for disassembly (Section 7.1, “Preparation for Disassembly”).

2. Remove the computer access panel (Section 7.3, “Computer Access Panel”).

WARNING: To reduce risk of personal injury from hot surfaces, allow the internal system components to

cool before touching.

3. Remove the front bezel (Section 7.4, “Front Bezel,”).

4. Rotate the drive cage to its full upright position.

5. Open both latches of the memory module socket 1, and insert the memory module into the

socket 2. Begin by installing a module into the socket nearest the preinstalled module, and

install the modules following the numerical order of the sockets.

✎

A memory module can be installed in only one way. Match the notch on the module with the tab

on the memory socket.

1 2 ... 96 97 98 99 100 101 102 103 104 105 106 ... 181 182

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HP dx5150 Technical Information Page 101