Hp BL860C User Manual download pdf (Page 19)

USB Bot Mass Storage Driver: 00000020

Generic USB Mass Storage Driver: 00000020

CLPrelay App: 00000100

* Indicates active system firmware image. In this case =>3.02 indicates that this server does not

need system firmware updated to use the memory modules described in this document.

The firmware upgrade instructions are included in the Release Notes on the firmware package

download page for your server product. To locate the Release Notes and download the firmware:

1. Go to http://www.hp.com/bizsupport.

2. Select Download Drivers and Software.

3. Select HP Integrity Servers.

4. Select the link for your server product.

After the firmware has been downloaded, you can install the memory. To install DIMMs, see

“Installing DIMMs” (page 32).

Power Subsystem

The power subsystem is located on the system board. Each server blade receives bulk DC voltage

from the enclosure. The server blade power block converts the DC voltage from the enclosure to

the voltage required by the server blade. The server blade receives 12 V directly from the enclosure.

The voltage passes through E-Fuse circuitry that resides in the blade. The 12 V supply is always

on as long as a power supply is installed in the enclosure. A control line from the enclosure onboard

administrator (OA) can turn the E-Fuse on or off to supply or cut power to the blade. The 12 V gets

distributed to various point-of-load (POL) converters. The switched POL voltage rails are: 0.9 V,

1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5.0 V, 3.3 V standby, and 5.0 V standby.

Processor and Core Electronics Complex

The processor subsystem holds one or two Intel Itanium dual-core processor modules. It consists of

the zx2 core electronics complex (CEC), a front side bus, a memory and I/O controller, system

clock generation and distribution, multiple POL converters, and I

C circuitry for manageability and

fault detection.

The front side bus speed is 267 MHz. The zx2 CEC and the processor modules are located on

the system board. A Zero Insertion Force (ZIF) socket connects the processors to the system board.

Heatsinks, processor metal frames, and bolster plates are part of the mechanical attach requirements

for the processors and the zx2.

Enclosure Information

This installation document covers only the HP Integrity BL860c server blade, and does not include

specific server blade enclosure information. For the server blade c-Class enclosure information,

see http://h71028.www7.hp.com/enterprise/cache/316735-0-0-0-121.html.

Controls, Ports, and LEDs

This section describes the controls, ports, and LEDs found on the front panel and rear panel of your

HP Integrity server blade.

For more information on LED functions and descriptions, see Chapter 5: “Troubleshooting”

(page 86).

Enclosure Information 19

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Hp BL860C User Manual Page 19