HP Intel Xeon W3550 Specifications download pdf (Page 8)

Introduction

8 Thermal/Mechanical Design Guide

1.1 References

Material and concepts available in the following documents may be beneficial when

reading this document.

Notes:

1. Available electronically

1.2 Definition of Terms

Table 1-1. Reference Documents

Document Location Notes

Intel® Xeon® Processor 3500 Series Processor Datasheet,

Volume 1

321332 1

Intel® Xeon® Processor 3500 Series Processor Datasheet,

Volume 2

321344 1

Intel® Xeon® Processor 3500 Series Processor Specification

Update

321333 1

Table 1-2. Terms and Descriptions (Sheet 1 of 2)

Term Description

Bypass Bypass is the area between a passive heatsink and any object that can act to form a

duct. For this example, it can be expressed as a dimension away from the outside

dimension of the fins to the nearest surface.

DTS Digital Thermal Sensor reports a relative die temperature as an offset from TCC

activation temperature.

FSC Fan Speed Control

IHS Integrated Heat Spreader: a component of the processor package used to enhance the

thermal performance of the package. Component thermal solutions interface with the

processor at the IHS surface.

ILM Independent Loading Mechanism provides the force needed to seat the 1366-LGA land

package onto the socket contacts.

IOH Input Output Hub: a component of the chipset that provides I/O connections to PCIe,

drives and other peripherals

LGA1366 socket The processor mates with the system board through this surface mount, 1366-contact

socket.

PECI The Platform Environment Control Interface (PECI) is a one-wire interface that provides

a communication channel between Intel processor and chipset components to external

monitoring devices.

Case-to-ambient thermal characterization parameter (psi). A measure of thermal

solution performance using total package power. Defined as (T

CASE

– T

) / Total

Package Power. Heat source should always be specified for Ψ measurements.

Case-to-sink thermal characterization parameter. A measure of thermal interface

material performance using total package power. Defined as (T

CASE

– T

) / Total

Package Power.

Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal

performance using total package power. Defined as (T

– T

) / Total Package Power.

CASE

The case temperature of the TTV measured at the geometric center of the topside of the

IHS.

CASE

MAX

The maximum case temperature as specified in a component specification.

TCC Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature

by using clock modulation and/or operating frequency and input voltage adjustment

when the die temperature is very near its operating limits.

CONTROL

is a static value below TCC activation used as a trigger point for fan speed

control.

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