HP Intel Xeon W3550 Specifications download pdf (Page 14)

LGA1366 Socket

14 Thermal/Mechanical Design Guide

2.2 Attachment to Motherboard

The socket is attached to the motherboard by 1366 solder balls. There are no additional

external methods (that is, screw, extra solder, adhesive, and so on) to attach the

socket.

As indicated in Figure 2-4, the Independent Loading Mechanism (ILM) is not present

during the attach (reflow) process.

2.3 Socket Components

The socket has two main components, the socket body and Pick and Place (PnP) cover,

and is delivered as a single integral assembly. Refer to Appendix C for detailed

drawings.

2.3.1 Socket Body Housing

The housing material is thermoplastic or equivalent with UL 94 V-0 flame rating capable

of withstanding 260 °C for 40 seconds (typical reflow/rework). The socket coefficient of

thermal expansion (in the XY plane), and creep properties, must be such that the

integrity of the socket is maintained for the conditions listed in Chapter 7.

The color of the housing will be dark as compared to the solder balls to provide the

contrast needed for pick and place vision systems.

2.3.2 Solder Balls

A total of 1366 solder balls corresponding to the contacts are on the bottom of the

socket for surface mounting with the motherboard.

The socket has the following solder ball material:

• Lead free SAC (SnAgCu) solder alloy with a silver (Ag) content between 3% and

4% and a melting temperature of approximately 217 °C. The alloy must be

compatible with immersion silver (ImAg) motherboard surface finish and a SAC

alloy solder paste.

The co-planarity (profile) and true position requirements are defined in Appendix C.

Figure 2-4. Attachment to Motherboard

LGA 1366 Socket

ILM

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HP Intel Xeon W3550 Specifications Page 14