Document Number: 321461-001Intel® Xeon® Processor 3500 SeriesThermal / Mechanical Design GuideMarch 2009
Introduction10 Thermal/Mechanical Design Guide
Thermal/Mechanical Design Guide 11LGA1366 Socket2 LGA1366 SocketThis chapter describes a surface mount, LGA (Land Grid Array) socket intended for Int
LGA1366 Socket12 Thermal/Mechanical Design GuideFigure 2-2. LGA1366 Socket Contact Numbering (Top View of Socket) 31 29 27 25 23 21 19 1
Thermal/Mechanical Design Guide 13LGA1366 Socket2.1 Board LayoutThe land pattern for the LGA1366 socket is 40 mils X 40 mils (X by Y), and the pad siz
LGA1366 Socket14 Thermal/Mechanical Design Guide2.2 Attachment to MotherboardThe socket is attached to the motherboard by 1366 solder balls. There are
Thermal/Mechanical Design Guide 15LGA1366 Socket2.3.3 ContactsBase material for the contacts is high strength copper alloy. For the area on socket con
LGA1366 Socket16 Thermal/Mechanical Design Guide2.4 Package Installation / RemovalAs indicated in Figure 2-6, access is provided to facilitate manual
Thermal/Mechanical Design Guide 17LGA1366 Socket2.5 DurabilityThe socket must withstand 30 cycles of processor insertion and removal. The max chain co
LGA1366 Socket18 Thermal/Mechanical Design Guide2.9 LGA1366 Socket NCTF Solder JointsIntel has defined selected solder joints of the socket as non-cri
Thermal/Mechanical Design Guide 19Independent Loading Mechanism (ILM)3 Independent Loading Mechanism (ILM)The Independent Loading Mechanism (ILM) prov
2 Thermal and Mechanical Design GuideINFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY E
Independent Loading Mechanism (ILM)20 Thermal/Mechanical Design Guide3.1.2 ILM Back Plate Design OverviewThe back plate for single processor workstati
Thermal/Mechanical Design Guide 21Independent Loading Mechanism (ILM).Figure 3-2. ILM AssemblySocket Body with Back Plate on boardSocket Body Reflowed
Independent Loading Mechanism (ILM)22 Thermal/Mechanical Design GuideAs indicated in Figure 3-3, socket protrusion and ILM key features prevent 180-de
Thermal/Mechanical Design Guide 23LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications4 LGA1366 Socket and ILM Electrical,
LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications24 Thermal/Mechanical Design Guide4.4 Loading SpecificationsThe socket
Thermal/Mechanical Design Guide 25LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications4.6 Environmental RequirementsDesign,
LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications26 Thermal/Mechanical Design GuideA detailed description of this method
Thermal/Mechanical Design Guide 27Sensor Based Thermal Specification Design Guidance5 Sensor Based Thermal Specification Design GuidanceThe introducti
Sensor Based Thermal Specification Design Guidance28 Thermal/Mechanical Design Guide5.2 Sensor Based Thermal SpecificationThe sensor based thermal spe
Thermal/Mechanical Design Guide 29Sensor Based Thermal Specification Design GuidanceAs in previous product specifications, a knowledge of the system b
Thermal and Mechanical Design Guide 3Contents1Introduction...
Sensor Based Thermal Specification Design Guidance30 Thermal/Mechanical Design Guide5.3 Thermal Solution Design ProcessThermal solution design guidanc
Thermal/Mechanical Design Guide 31Sensor Based Thermal Specification Design GuidanceNote: If the assumed TAMBIENT is inappropriate for the intended sy
Sensor Based Thermal Specification Design Guidance32 Thermal/Mechanical Design Guide5.3.3 Thermal Solution Validation5.3.3.1 Test for Compliance to th
Thermal/Mechanical Design Guide 33Sensor Based Thermal Specification Design GuidanceNote: This data is taken from the validation of the RCBF5 referenc
Sensor Based Thermal Specification Design Guidance34 Thermal/Mechanical Design Guide5.4.1 Fan Speed Control Algorithm without TAMBIENT DataIn a system
Thermal/Mechanical Design Guide 35Sensor Based Thermal Specification Design Guidance5.4.2 Fan Speed Control Algorithm with TAMBIENT DataIn a system wh
Sensor Based Thermal Specification Design Guidance36 Thermal/Mechanical Design Guide5.5 System ValidationSystem validation should focus on ensuring th
Thermal/Mechanical Design Guide 37Sensor Based Thermal Specification Design Guidance5.6 Specification for Operation Where Digital Thermal Sensor Excee
Sensor Based Thermal Specification Design Guidance38 Thermal/Mechanical Design Guide
Thermal/Mechanical Design Guide 39ATX Reference Thermal Solution6 ATX Reference Thermal SolutionNote: The reference thermal mechanical solution inform
4 Thermal and Mechanical Design Guide6.4.1 Extrusion...426
ATX Reference Thermal Solution40 Thermal/Mechanical Design Guide6.2 Heatsink Thermal Solution AssemblyThe reference thermal solution for the processor
Thermal/Mechanical Design Guide 41ATX Reference Thermal Solution6.3 Geometric Envelope for the Intel® Reference ATX Thermal Mechanical DesignFigure 6-
ATX Reference Thermal Solution42 Thermal/Mechanical Design Guide6.4 Reference Design Components6.4.1 ExtrusionThe aluminum extrusion is a 51 fin 102 m
Thermal/Mechanical Design Guide 43ATX Reference Thermal Solution6.4.2 ClipStructural design strategy for the clip is to provide sufficient load for th
ATX Reference Thermal Solution44 Thermal/Mechanical Design Guide6.4.3 CoreThe core is the same forged design used in RCFH4. This allows the reuse of t
Thermal/Mechanical Design Guide 45ATX Reference Thermal SolutionFigure 6-6. Clip Core and Extrusion AssemblyFigure 6-7. Critical Parameters for Interf
ATX Reference Thermal Solution46 Thermal/Mechanical Design Guide6.6 Heatsink Mass and Center of Gravity• Total assembly mass ≤ 550 gm (grams), excludi
Thermal/Mechanical Design Guide 47Thermal Solution Quality and Reliability Requirements7 Thermal Solution Quality and Reliability Requirements7.1 Refe
Thermal Solution Quality and Reliability Requirements48 Thermal/Mechanical Design Guide7.2.2 Post-Test Pass CriteriaThe post-test pass criteria are:1.
Thermal/Mechanical Design Guide 49Component SuppliersA Component SuppliersNote: The part numbers listed below identifies the reference components. End
Thermal and Mechanical Design Guide 5B-6 Reference Design Heatsink Assembly (2 of 2) ... 57B
Component Suppliers50 Thermal/Mechanical Design Guide
Thermal/Mechanical Design Guide 51Mechanical DrawingsB Mechanical DrawingsTable B-1 lists the mechanical drawings included in this appendix.Table B-1.
Mechanical Drawings52 Thermal/Mechanical Design GuideFigure B-1. Socket / Heatsink / ILM Keepout Zone Primary Side (Top)8 7
Thermal/Mechanical Design Guide 53Mechanical DrawingsFigure B-2. Socket / Heatsink / ILM Keepout Zone Secondary Side (Bottom)HGFEDCBAHGFEDCBA8
Mechanical Drawings54 Thermal/Mechanical Design GuideFigure B-3. Socket / Processor / ILM Keepout Zone Primary Side (Top)
Thermal/Mechanical Design Guide 55Mechanical DrawingsFigure B-4. Socket / Processor / ILM Keepout Zone Secondary Side (Bottom)
Mechanical Drawings56 Thermal/Mechanical Design GuideFigure B-5. Reference Design Heatsink Assembly (1 of 2)
Thermal/Mechanical Design Guide 57Mechanical DrawingsFigure B-6. Reference Design Heatsink Assembly (2 of 2)
Mechanical Drawings58 Thermal/Mechanical Design GuideFigure B-7. Reference Fastener Sheet 1 of 4
Thermal/Mechanical Design Guide 59Mechanical DrawingsFigure B-8. Reference Fastener Sheet 2 of 4
6 Thermal and Mechanical Design GuideRevision History§Revision NumberDescription Revision Date-001 • Initial release March 2009
Mechanical Drawings60 Thermal/Mechanical Design GuideFigure B-9. Reference Fastener Sheet 3 of 4
Thermal/Mechanical Design Guide 61Mechanical DrawingsFigure B-10. Reference Fastener Sheet 4 of 4
Mechanical Drawings62 Thermal/Mechanical Design GuideFigure B-11. Reference Clip - Sheet 1 of 28 7 6
Thermal/Mechanical Design Guide 63Mechanical Drawings§Figure B-12. Reference Clip - Sheet 2 of 21345678BCDA12345678BCDATHIS DRAWING CONTAINS INTEL COR
Mechanical Drawings64 Thermal/Mechanical Design Guide
Thermal/Mechanical Design Guide 65Socket Mechanical DrawingsC Socket Mechanical DrawingsTable C-1 lists the mechanical drawings included in this appen
Socket Mechanical Drawings66 Thermal/Mechanical Design GuideFigure C-1. Socket Mechanical Drawing (Sheet 1 of 4)
Thermal/Mechanical Design Guide 67Socket Mechanical DrawingsFigure C-2. Socket Mechanical Drawing (Sheet 2 of 4)
Socket Mechanical Drawings68 Thermal/Mechanical Design GuideFigure C-3. Socket Mechanical Drawing (Sheet 3 of 4)
Thermal/Mechanical Design Guide 69Socket Mechanical Drawings§Figure C-4. Socket Mechanical Drawing (Sheet 4 of 4)
Thermal/Mechanical Design Guide 7Introduction1 IntroductionThis document provides guidelines for the design of thermal and mechanical solutions for th
Socket Mechanical Drawings70 Thermal/Mechanical Design Guide
Thermal/Mechanical Design Guide 71Processor Installation ToolD Processor Installation ToolThe following optional tool is designed to provide mechanica
Processor Installation Tool72 Thermal/Mechanical Design Guide§Figure D-1. Processor Installation Tool
Introduction8 Thermal/Mechanical Design Guide1.1 ReferencesMaterial and concepts available in the following documents may be beneficial when reading t
Thermal/Mechanical Design Guide 9Introduction§TDP Thermal Design Power: Thermal solution should be designed to dissipate this target power level. TDP
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