HP Intel Xeon W3550 Specifications download pdf (Page 36)

Sensor Based Thermal Specification Design Guidance

36 Thermal/Mechanical Design Guide

5.5 System Validation

System validation should focus on ensuring the fan speed control algorithm is

responding appropriately to the DTS values and T

AMBIENT

data as well as any other

device being monitored for thermal compliance.

Since the processor thermal solution has already been validated using the TTV to the

thermal specifications at the predicted T

AMBIENT

, additional TTV based testing in the

chassis is not expected to be necessary.

Once the heatsink has been demonstrated to meet the TTV Thermal Profile, it should be

evaluated on a functional system at the boundary conditions.

In the system under test and Power/Thermal Utility Software set to dissipate the TDP

workload confirm the following item:

• Verify if there is TCC activity by instrumenting the PROCHOT# signal from the

processor. TCC activation in functional application testing is unlikely with a

compliant thermal solution. Some very high power applications might activate TCC

for short intervals this is normal.

• Verify fan speed response is within expectations - actual RPM (Ψ

) is consistent

with DTS temperature and T

AMBIENT

• Verify RPM vs. PWM command (or voltage) output from the FSC device is within

expectations.

• Perform sensitivity analysis to asses impact on processor thermal solution

performance and acoustics for the following:

— Other fans in the system.

— Other thermal loads in the system.

In the same system under test, run real applications that are representative of the

expected end user usage model and verify the following:

• TCC activation is not occurring.

• Verify fan speed response vs. expectations as done using Power/Thermal Utility

SW.

• Validate system boundary condition assumptions: Trise, venting locations, other

thermal loads and adjust models / design as required.

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HP Intel Xeon W3550 Specifications Page 36