HP Intel Xeon W3550 Specifications download pdf (Page 28)

Sensor Based Thermal Specification Design Guidance

28 Thermal/Mechanical Design Guide

5.2 Sensor Based Thermal Specification

The sensor based thermal specification consists of two parts. The first is a thermal

profile that defines the maximum TTV T

CASE

as a function of TTV power dissipation. The

thermal profile defines the boundary conditions for validation of the thermal solution.

The second part is a defined thermal solution performance (Ψ

) as a function of the

DTS value as reported over the PECI bus when DTS is greater than T

CONTROL

. This

defines the operational limits for the processor using the TTV validated thermal

solution.

5.2.1 TTV Thermal Profile

For the sensor based specification the only reference made to a case temperature

measurement is on the TTV. Functional thermal validation will not require the user to

apply a thermocouple to the processor package or measure processor power.

Note: All functional compliance testing will be based on fan speed response to the reported

DTS values above T

CONTROL

. As a result no conversion of TTV T

CASE

to processor T

CASE

will be necessary.

Figure 5-1. Comparison of Case Temperature vs. Sensor Based Specification

Power

Sensor Based Specification (DTS Temp)

TDP

Tcontrol

Ta = 30 C

Ψ-ca = 0.362

Ψ-ca = 0.292

Power

Current Specification (Case Temp)

TDP

Tcontrol

Ta = 43.2 C

Ta = 30 C

Ψ-ca = 0.292

Power

Sensor Based Specification (DTS Temp)

TDP

Tcontrol

Ta = 30 C

Ψ-ca = 0.362

Ψ-ca = 0.292

Power

Current Specification (Case Temp)

TDP

Tcontrol

Ta = 43.2 C

Ta = 30 C

Ψ-ca = 0.292

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