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6
Thermal and Mechanical Design Guide
Revision History
§
Revision
Number
Description
Revision Date
-001
•
Initial release
March 2009
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March 2009
1
Contents
3
Revision History
6
1 Introduction
7
1.1 References
8
1.2 Definition of Terms
8
Introduction
10
2 LGA1366 Socket
11
LGA1366 Socket
12
2.1 Board Layout
13
2.2 Attachment to Motherboard
14
2.3 Socket Components
14
2.3.3 Contacts
15
2.3.4 Pick and Place Cover
15
2.5 Durability
17
2.6 Markings
17
2.8 Socket Size
17
3 Independent Loading
19
Figure 3-2. ILM Assembly
21
Protrusion
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4 LGA1366 Socket and ILM
23
4.4 Loading Specifications
24
4.5 Electrical Requirements
24
5 Sensor Based Thermal
27
5.2.1 TTV Thermal Profile
28
TTV Power (W)
29
Psi-ca System (BA)
33
5.5 System Validation
36
Sensor Exceeds T
37
6 ATX Reference Thermal
39
Reference ATX
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Thermal Mechanical Design
41
6.4.1 Extrusion
42
6.4.2 Clip
43
Mechanism
44
Core shoulder
45
Dia 38.68 +/- 0.30mm
46
Dia 36.14 +/- 0.10 mm
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Thermal Solution Quality and
47
Reliability Requirements
47
7.2.2 Post-Test Pass Criteria
48
A Component Suppliers
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Component Suppliers
50
B Mechanical Drawings
51
BOARD PRIMARY SIDE
52
BOARD SECONDARY SIDE
53
Mechanical Drawings
54
C Socket Mechanical Drawings
65
Socket Mechanical Drawings
66
D Processor Installation Tool
71
Processor Installation Tool
72
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