HP Proliant DL580 Specifications

HP ProLiant DL580 G7 Server Maintenance and Service Guide Abstract This document describes service procedures for the HP ProLiant DL580 G7 Server. T

Customer self repair 10 Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma van HP. Informatie over

Customer self repair 11 No caso desse serviço, a substituição de peças CSR é obrigatória. Se desejar que a HP substitua essas peças, serão cobradas

Customer self repair 12

Customer self repair 13

Customer self repair 14

Customer self repair 15

Illustrated parts catalog 16 Illustrated parts catalog Mechanical components Item Description Spare part number Customer self repair (on page

Illustrated parts catalog 17 Item Description Spare part number Customer self repair (on page 5) e) Blank, power supply — Mandatory1 2 Access p

Illustrated parts catalog 18 sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía correspondiente al p

Illustrated parts catalog 19 System components Item Description Spare part number Customer self repair (on page 5) 6 Power supplies — — a)

© Copyright 2010, 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warr

Illustrated parts catalog 20 Item Description Spare part number Customer self repair (on page 5) e) Intel Xeon L7555 processor kit* ** 594900-00

Illustrated parts catalog 21 Item Description Spare part number Customer self repair (on page 5) d) 8-GB PC3 10600R, dual rank* 501536-001 Mand

Illustrated parts catalog 22 Item Description Spare part number Customer self repair (on page 5) f) BBWC cache module, 512-MB* 462975-001 Optio

Illustrated parts catalog 23 2Optional: Opzionali—Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti prog

Illustrated parts catalog 24

Removal and replacement procedures 25 Removal and replacement procedures Required tools You need the following items for some procedures: • Torx T-

Removal and replacement procedures 26 • Remove the server from the rack (on page 27). If the rack environment, cabling configuration, or the server

Removal and replacement procedures 27 2. Extend the server on the rack rails until the server rail-release latches engage. 3. After performing t

Removal and replacement procedures 28 2. Remove the following components to reduce the weight of the server: o Processor memory drawer ("Remov

Removal and replacement procedures 29 Remove the processor memory drawer To remove the component: 1. Power down the server (on page 26). 2. Remove

Contents 3 Contents Customer self repair ...

Removal and replacement procedures 30 To replace the component, reverse the removal procedure. Remove the SPI board To remove the component: 1. Po

Removal and replacement procedures 31 3. Remove the hard drive. To replace the component, reverse the removal procedure. Heatsink To remove the co

Removal and replacement procedures 32 5. Open the processor retaining bracket. 6. Remove the heatsink. To replace the component: 1. Clean the ol

Removal and replacement procedures 33 2. Remove the heatsink protective cover. 3. Install the heatsink. 4. Close and lock the processor retaining

Removal and replacement procedures 34 WARNING: Use caution when installing the processor memory module or removing the processor memory module. Th

Removal and replacement procedures 35 5. Open the processor retaining bracket. 6. Remove the heatsink.

Removal and replacement procedures 36 7. Open the processor locking lever and the processor socket retaining bracket. 8. Using the processor tool,

Removal and replacement procedures 37 9. Carefully rotate the tool, and then push in and release the tabs to secure the processor in the tool. C

Removal and replacement procedures 38 2. Be sure the tool is oriented correctly. Align the processor installation tool with the socket, and then ins

Removal and replacement procedures 39 3. Press and hold the tabs on the processor installation tool to separate it from the processor, and then remo

Contents 4 Diagnostic tools ...

Removal and replacement procedures 40 6. Apply all the grease to the top of the processor in the following pattern to ensure even distribution. 7.

Removal and replacement procedures 41 IMPORTANT: Be sure you are using the correct spare part number when replacing the memory cartridge. The serv

Removal and replacement procedures 42 6. Open the memory cartridge cover. 7. Remove the DIMMs from the failed memory cartridge: a. Open the DIMM

Removal and replacement procedures 43 b. Install the DIMM. 2. Close the memory cartridge cover. 3. Install the memory cartridge. 4. Install the

Removal and replacement procedures 44 CAUTION: To prevent damage to the processor memory drawer cover, be sure the handle of the processor memor

Removal and replacement procedures 45 6. Open the memory cartridge cover. 7. Remove the failed DIMM from the memory cartridge: a. Open the DIMM s

Removal and replacement procedures 46 b. Install the DIMM. 2. Close the memory cartridge cover. 3. Install the memory cartridge. 4. Install the

Removal and replacement procedures 47 Power supply blank Remove the component as indicated. To replace the component, reverse the removal procedure

Removal and replacement procedures 48 2. Remove the failed power supply. To replace the component, reverse the removal procedure. Systems Insight

Removal and replacement procedures 49 To replace the component, reverse the removal procedure. Fan To remove the component: 1. Extend the server

Customer self repair 5 Customer self repair HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow fo

Removal and replacement procedures 50 5. Remove the fan louver. CAUTION: Do not operate the server unless a fan louver is installed next to fan

Removal and replacement procedures 51 4. Release the latches on the release lever. 5. Lower the handle, and then extend the processor memory drawe

Removal and replacement procedures 52 o PCI-X/PCIe Express I/O expansion board o PCIe Express I/O expansion board To replace the component, rever

Removal and replacement procedures 53 3. Remove the access panel (on page 28). 4. Disconnect the cable from the rear of the DVD-ROM drive. 5. Remo

Removal and replacement procedures 54 To replace the component, reverse the removal procedure. Expansion slot cover CAUTION: To prevent imprope

Removal and replacement procedures 55 Non-hot-plug expansion board CAUTION: To prevent improper cooling and thermal damage, do not operate the s

Removal and replacement procedures 56 7. Remove the expansion board. To replace the component, reverse the removal procedure. Battery-backed write

Removal and replacement procedures 57 4. If the existing cache is connected to a battery, observe the BBWC Status LED ("Battery pack LEDs"

Removal and replacement procedures 58 o If the LED is not illuminated, disconnect the battery cable from the cache. 5. Disconnect the cable. 6. R

Removal and replacement procedures 59 o If the server has failed, remove the controller, cache module ("Removing the BBWC cache module" on

Customer self repair 6 Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièc

Removal and replacement procedures 60 5. Disconnect the cable. 6. Remove the SPI board (on page 30). 7. Open the cache slot latches. 8. Remove t

Removal and replacement procedures 61 To remove the component: 1. Power down the server (on page 26). 2. Extend the server from the rack (on page

Removal and replacement procedures 62 Battery If the server no longer automatically displays the correct date and time, you may need to replace the

Removal and replacement procedures 63 WARNING: The server weighs approximately 36.3 kg–49.9 kg (80.0 lb–110.0 lb). To reduce the risk of injury, r

Removal and replacement procedures 64 1. Install the spare system board. 2. Install all components removed from the server. 3. Install the access

Removal and replacement procedures 65 SAS backplane To remove the component: 1. Power down the server (on page 26). 2. Extend the server from the

Removal and replacement procedures 66 8. Remove the backplane. To replace the component, reverse the removal procedure. HP Trusted Platform Module

Diagnostic tools 67 Diagnostic tools Troubleshooting resources The HP ProLiant Servers Troubleshooting Guide provides procedures for resolving commo

Diagnostic tools 68 support ProLiant BL, ML, DL, and SL servers. The toolkit includes a modular set of utilities and important documentation that de

Diagnostic tools 69 For more information about the controller and its features, see the HP Smart Array Controllers for HP ProLiant Servers User Guid

Customer self repair 7 In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il giorno lavorativo s

Diagnostic tools 70 For more information, see the Management CD or DVD in the HP Insight Foundation suite for ProLiant. Insight Lights-Out 3 techno

Diagnostic tools 71 HP Insight Diagnostics Online Edition is a web-based application that captures system configuration and other related data neede

Component identification 72 Component identification Front panel components Item Description 1 Serial and PID tag 2 Optical drive 3 Systems In

Component identification 73 Front panel LEDs and buttons Item Description Status 1 UID button and LED Blue—Activated Blue (flashing)—Server b

Component identification 74 Systems Insight Display The Systems Insight Display LEDs represent the server and component layout. LED Descriptio

Component identification 75 Rear panel components Item Description Item Description 1 Power supply bay 4 (optional) 15 Expansion slot

Component identification 76 Rear panel LEDs and buttons Item Description LED color Status 1 iLO 3 NIC Activity LED Green On or flashing—Ne

Component identification 77 Power supply LED Power LED Status Off No AC power to power supply units Green AC is present. Standby outpu

Component identification 78 System board components Item Description 1 Optional I/O expansion board connectors: • PCI-X/PCI Express I/O ex

Component identification 79 System maintenance switch The system maintenance switch (SW1) is an eight-position switch that is used for system conf

Customer self repair 8 defekte Teil nicht zurückschicken, kann HP Ihnen das Ersatzteil in Rechnung stellen. Im Falle von Customer Self Repair kommt

Component identification 80 SPI board components Item Description 1 Mini-SAS connectors (2) 2 SAS cache connector 3 TPM connector 4 Fan data c

Component identification 81 I/O expansion board components • PCI-X/PCI Express I/O expansion board Item Description 1 Slot 6 PCIe2 x16 (16, 8

Component identification 82 **Slots 2, 3, 5 and 6 are physically x16 slots but operate electrically as x8 slots. Processors and memory cartridges

Component identification 83 DIMM slot locations Each memory module contains 8 DIMM slots. The paired banks are identified by the letters A through D

Component identification 84 Hard drive LEDs Item Description 1 Fault/UID LED (amber/blue) 2 Online LED (green) Hard drive LED combinations

Component identification 85 Online/activity LED (green) Fault/UID LED (amber/blue) Interpretation Off Steadily amber A critical fault condition has

Component identification 86 LED3 pattern LED4 pattern Interpretation Off Flashing (2 Hz) The system is powered down, and the cache contains

Component identification 87 FBWC module LEDs The FBWC module has two single-color LEDs (green and amber). The LEDs are duplicated on the reverse sid

Component identification 88 Fan locations Power supply backplane components

Component identification 89 Item Description 1 Graphics card power connector 2 Graphics card power connector 3 Graphics card power connector 4

Customer self repair 9 enviara el componente defectuoso requerido, HP podrá cobrarle por el de sustitución. En el caso de todas sustituciones que ll

Cabling 90 Cabling DVD-ROM drive cabling

Specifications 91 Specifications Environmental specifications Specification Value Temperature range* Operating 10°C to 35°C (50°F to 95°F) Ship

Acronyms and abbreviations 92 Acronyms and abbreviations ABEND abnormal end ASR Automatic Server Recovery BBWC battery-backed write cache FBWC fl

Acronyms and abbreviations 93 RBSU ROM-Based Setup Utility SAS serial attached SCSI SD Secure Digital SIM Systems Insight Manager SPI system per

Documentation feedback 94 Documentation feedback HP is committed to providing documentation that meets your needs. To help us improve the documentat

Index 95 A access panel 28 ASR (Automatic Server Recovery) 70 Automatic Server Recovery (ASR) 70 B backplane, hard drive 65 backplane, power

Index 96 I I/O expansion board components 81 I/O expansion boards, removing 50 illustrated parts catalog 16 iLO (Integrated Lights-Out) 70 I

Index 97 status lights, battery pack 85 support packs 67 switch, system maintenance 78 system battery 80 system board 19, 62, 65 system bo