HP 2312TU Technical Information Page 87

  • Download
  • Add to my manuals
  • Print
  • Page
    / 115
  • Table of contents
  • BOOKMARKS
  • Rated. / 5. Based on customer reviews
Page view 86
Thermal paste is used on the processor (1) and the heat sink section (2) that services it
A thermal pad is used on the Northbridge chip (3) and the heat sink section (4) that services it
NOTE: The following illustration shows the replacement thermal material locations on a computer
model equipped with an Intel Celeron processor.
Thermal paste is used on the processor (1) and the heat sink section (2) that services it
A thermal pad is used on the Northbridge chip (3) and the heat sink section (4) that services it
Reverse this procedure to reassemble and install the fan/heat sink assembly.
Component replacement procedures 79
Page view 86
1 2 ... 82 83 84 85 86 87 88 89 90 91 92 ... 114 115

Comments to this Manuals

No comments