HP Integrity rx2600 Specifications download pdf (Page 16)

• Chipset

– HP zx1 Chipset

– 105-nanosecond memory latency

– 6.4 GB/s system bus bandwidth

– 4.0 GB/s aggregate I/O bandwidth

• Expansion slots

– 3 PCI-X on independent buses, 64-bit 133 MHz

– 6 PCI-X on 3 shared buses, 64-bit 66 MHz

– 1 PCI for graphics/USB, 64-bit 33 MHz

• Hot-plug disk drives (4 bays)

– 584 GB maximum internal storage

– 2 dual Ultra160 SCSI controllers

– Optional high-availability (duplex) configuration for internal disk drives

– Disk sizes available: 36 GB 15,000 rpm, 73 GB 15,000 rpm, 146 GB 10,000 rpm

• Removable media

– One open media bay for optional SCSI devices

– Choice of DVD-ROM or DDS-3

• Core I/O interconnect ports

– Gigabit-TX LAN with RJ-45 connector (10/100/1000BT auto-sensing)

– Ultra160 SCSI port for external peripherals

– Management processor interconnect:

10/100BT management LAN with Web console access

RS-232 local console

RS-232 remote/modem console

RS-232 general purpose

– 2 USB Series A 2.0 (480 Mb/s) ports (optional)

– VGA (optional)

• Power and cooling

– 2 930 W hot-swap power supplies standard

– Optional third 930 W hot-swap power supply for N+1 redundancy

– 8 cooling fans with N+1 redundancy

• Power requirements

– Input current: 10 A at 100–120 V, 5 A at 200–240 V (voltage auto-ranging)

– Line frequency: 50 Hz to 60 Hz

– Maximum power input: 1600 W (conservative), 1250 W (typical)

Physical and environmental specifications

• Environmental specifications

– Altitude:

Operating: 3000 m (10,000 ft.) maximum

Storage: 4600 m (15,000 ft.) maximum

– Temperature:

Operating: +05° C to +35° C (+41° F to +95° F)

Non-operating: –40° C to +70° C (–40° F to +158° F)

– Humidity:

Operating: 15% to 80% (relative, non-condensing)

• Physical dimensions in rack orientation

– Height: 31.1 cm (12.2 in.), 7U EIA

– Width: 48.2 cm (19 in.)

– Depth: 77.4 cm (30.5 in.)

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HP Integrity rx2600 Specifications Page 16

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