HP Compaq dc7900 USDT Specifications Page 9
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Technical Reference Guide www.hp.com 1-3
Introduction
1.5 Common Acronyms and Abbreviations
Table 1-1 lists the acronyms and abbreviations used in this guide.
Table 1-1
Acronyms and Abbreviations
Acronym or
Abbreviation Description
Aampere
AC alternating current
ACPI Advanced Configuration and Power Interface
A/D analog-to-digital
ADC Analog-to-digital converter
ADD or ADD2 Advanced digital display (card)
AGP Accelerated graphics port
AHCI SATA Advanced Host controller Interface
AMT Active Management Technology
API application programming interface
APIC Advanced Programmable Interrupt Controller
APM advanced power management
AOL Alert-On-LAN™
ASIC application-specific integrated circuit
ASF Alert Standard Format
AT 1. attention (modem commands) 2. 286-based PC architecture
ATA AT attachment (IDE protocol)
ATAPI ATA w/packet interface extensions
AVI audio-video interleaved
AVGA Advanced VGA
AWG American Wire Gauge (specification)
BAT Basic assurance test
BCD binary-coded decimal
BIOS basic input/output system
bis second/new revision
BNC Bayonet Neill-Concelman (connector type)
bps or b/s bits per second
BSP Bootstrap processor
BTO Built to order
CAS column address strobe
CD compact disk
CD-ROM compact disk read-only memory
- Technical Reference Guide 1
- Contents 3
- 3 Processor/Memory Subsystem 4
- 4 System Support 4
- 5 Input/Output Interfaces 4
- 8SYSTEM BIOS 6
- A Error Messages and Codes 6
- 1.4 Notational Conventions 8
- Table 1-1 9
- Table 1-1 (Continued) 10
- Introduction 16
- System Overview 17
- 2.2 Features 18
- Table 2-1 19
- 2.3 System Architecture 20
- Power Supply 21
- 2.3.1 Intel Processor Support 22
- 2.3.2 Chipset 23
- 2.3.3 Support Components 24
- 2.3.4 System Memory 24
- 2.3.5 Mass Storage 25
- 2.3.6 Serial Interface 25
- 2.3.9 Graphics Subsystem 26
- 2.3.10 Audio Subsystem 26
- 2.4 Specifications 27
- Table 2-8 28
- Physical Specifications 28
- Table 2-9 29
- Optical Drive Specifications 29
- Table 2-10 30
- Hard Drive Specifications 30
- Processor/Memory Subsystem 31
- 3.2 Intel Processors 32
- 3.3 Memory Subsystem 34
- 3.3.1 Memory Upgrading 35
- System Support 37
- Software/Driver Layer 39
- Transaction Protocol Layer 39
- 4.2.3 Option ROM Mapping 40
- 4.2.4 PCI Interrupts 40
- 4.2.6 PCI Connectors 41
- PCI Express Connectors 42
- 4.3 System Resources 43
- 4.3.2 Direct Memory Access 44
- 4.4.1 Clearing CMOS 45
- 4.5 System Management 46
- Power-On / Setup Password 47
- Setup Password 47
- Cable Lock Provision 47
- I/O Interface Security 47
- Chassis Security 47
- 4.5.2 Power Management 48
- 4.5.3 System Status 49
- 4.6.1 System I/O Map 50
- Table 4-9 51
- System I/O Map 51
- 4.6.2 GPIO Functions 52
- Input/Output Interfaces 53
- 5.2 SATA/eSATA Interfaces 54
- 5.2.2 eSATA interface 55
- 5.3 Diskette Drive Interface 56
- Table 5-3 57
- 5.4 Serial Interface 58
- Table 5-5 60
- Table 5-6 62
- 5.7.1 USB Connector 63
- 5.7.2 USB Cable Data 64
- 5.8 Audio Subsystem 65
- 5.8.1 HD Audio Controller 66
- 5.8.2 HD Audio Link Bus 66
- 5.8.3 Audio Multistreaming 66
- 5.8.4 Audio Specifications 67
- 5.9.1 Wake-On-LAN Support 69
- 5.9.4 NIC Connector 70
- 5.9.5 NIC Specifications 70
- Integrated Graphics Subsystem 71
- Controller 72
- Table 6-1 73
- GMA 4500 Memory Allocation 73
- 6.3 Display Modes 74
- 6.4 Upgrading 75
- 6.5 Monitor Connectors 76
- 6.5.2 DisplayPort Connector 77
- Power and Signal Distribution 79
- Table 7-1 80
- Table 7-2 81
- Table 7-3 82
- 7.2.3 Energy Star Compliancy 83
- 7.3 Power C on tro l 84
- Table 7-5 85
- Power LED Indications 85
- Power LED Condition 85
- 7.3.2 Wake Up Events 86
- 7.3.3 Power Management 87
- 7.4 Signal Distribution 88
- Table 7-7. (Continued) 89
- SYSTEM BIOS 91
- 8.2 ROM Flashing 92
- 8.3 Boot Functions 93
- 8.3.4 Boot Error Codes 94
- Table 8-2 95
- 8.4.1 System ID and ROM Type 96
- 8.4.2 Temperature Status 96
- 8.5 SMBIOS 97
- 8.6 USB Legacy Support 98
- Error Messages and Codes 102
- Table A-2. (Continued) 102
- Error Message Probable Cause 102
- 67xx-xx) 116
- (8601-xx) 117
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