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7-4 www.hp.com Technical Reference Guide
Power and Signal Distribution
Table 7-3 lists the specifications for the 365-watt power supply used in the CMT form factor.
NOTES:
Total continuous output power should not exceed 365 watts. Maximum surge power should not exceed 385 watts.. Maximum
combined power of +5 and +3.3 VDC is 160 watts.
[1] Minimum loading requirements must be met at all times to ensure normal operation and specification compliance.
[2] Maximum surge duration for +12Vcpu is 1 second with 12-volt tolerance +/- 10%.
Table 7-3.
CMT 365-Watt Power Supply Unit Specifications
Range or
Tolerance
Min.
Current
Loading [1]
Max.
Current
Surge
Current [2]
Max.
Ripple
Input Line Voltage:
115–230 VAC (auto-ranging) 90–264 VAC -- -- -- --
Line Frequency 47–63 Hz -- -- -- --
Input (AC) Current -- -- 6.0 A -- --
+3.3 VDC Output +
4 % 0.10 A 24.0 A 24.0 A 50 mV
+5.08 VDC Output +
3.3 % 0.30 A 19.0 A 19.0 A 50 mV
+5.08 AUX Output +
3.3 % 0.00 A 3.00 A 3.00 A 50 mV
+12 VDC Output +
5 % 0.20 A 12.0 A 14.5 A 120 mV
+12 VDC Output (Vcpu) +
5 % 0.00 A 14.5 A 17.5 A 200 mv
-12 VD C Output +
10 % 0.00 A 0.15 A 0.15 A 200 mV
- Technical Reference Guide 1
- Contents 3
- 3 Processor/Memory Subsystem 4
- 4 System Support 4
- 5 Input/Output Interfaces 4
- 8SYSTEM BIOS 6
- A Error Messages and Codes 6
- 1.4 Notational Conventions 8
- Table 1-1 9
- Table 1-1 (Continued) 10
- Introduction 16
- System Overview 17
- 2.2 Features 18
- Table 2-1 19
- 2.3 System Architecture 20
- Power Supply 21
- 2.3.1 Intel Processor Support 22
- 2.3.2 Chipset 23
- 2.3.3 Support Components 24
- 2.3.4 System Memory 24
- 2.3.5 Mass Storage 25
- 2.3.6 Serial Interface 25
- 2.3.9 Graphics Subsystem 26
- 2.3.10 Audio Subsystem 26
- 2.4 Specifications 27
- Table 2-8 28
- Physical Specifications 28
- Table 2-9 29
- Optical Drive Specifications 29
- Table 2-10 30
- Hard Drive Specifications 30
- Processor/Memory Subsystem 31
- 3.2 Intel Processors 32
- 3.3 Memory Subsystem 34
- 3.3.1 Memory Upgrading 35
- System Support 37
- Software/Driver Layer 39
- Transaction Protocol Layer 39
- 4.2.3 Option ROM Mapping 40
- 4.2.4 PCI Interrupts 40
- 4.2.6 PCI Connectors 41
- PCI Express Connectors 42
- 4.3 System Resources 43
- 4.3.2 Direct Memory Access 44
- 4.4.1 Clearing CMOS 45
- 4.5 System Management 46
- Power-On / Setup Password 47
- Setup Password 47
- Cable Lock Provision 47
- I/O Interface Security 47
- Chassis Security 47
- 4.5.2 Power Management 48
- 4.5.3 System Status 49
- 4.6.1 System I/O Map 50
- Table 4-9 51
- System I/O Map 51
- 4.6.2 GPIO Functions 52
- Input/Output Interfaces 53
- 5.2 SATA/eSATA Interfaces 54
- 5.2.2 eSATA interface 55
- 5.3 Diskette Drive Interface 56
- Table 5-3 57
- 5.4 Serial Interface 58
- Table 5-5 60
- Table 5-6 62
- 5.7.1 USB Connector 63
- 5.7.2 USB Cable Data 64
- 5.8 Audio Subsystem 65
- 5.8.1 HD Audio Controller 66
- 5.8.2 HD Audio Link Bus 66
- 5.8.3 Audio Multistreaming 66
- 5.8.4 Audio Specifications 67
- 5.9.1 Wake-On-LAN Support 69
- 5.9.4 NIC Connector 70
- 5.9.5 NIC Specifications 70
- Integrated Graphics Subsystem 71
- Controller 72
- Table 6-1 73
- GMA 4500 Memory Allocation 73
- 6.3 Display Modes 74
- 6.4 Upgrading 75
- 6.5 Monitor Connectors 76
- 6.5.2 DisplayPort Connector 77
- Power and Signal Distribution 79
- Table 7-1 80
- Table 7-2 81
- Table 7-3 82
- 7.2.3 Energy Star Compliancy 83
- 7.3 Power C on tro l 84
- Table 7-5 85
- Power LED Indications 85
- Power LED Condition 85
- 7.3.2 Wake Up Events 86
- 7.3.3 Power Management 87
- 7.4 Signal Distribution 88
- Table 7-7. (Continued) 89
- SYSTEM BIOS 91
- 8.2 ROM Flashing 92
- 8.3 Boot Functions 93
- 8.3.4 Boot Error Codes 94
- Table 8-2 95
- 8.4.1 System ID and ROM Type 96
- 8.4.2 Temperature Status 96
- 8.5 SMBIOS 97
- 8.6 USB Legacy Support 98
- Error Messages and Codes 102
- Table A-2. (Continued) 102
- Error Message Probable Cause 102
- 67xx-xx) 116
- (8601-xx) 117
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