HP MINI 5103 User Manual Page 82

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System board
Description Spare part number
System board (includes processor and replacement thermal material)
Includes Intel Atom N455 1.66-GHz processor, 512-KB Level 2 cache, 667-MHz front-side bus
(FSB)
625687-001
Includes Intel Atom N475 1.83-GHz processor, 512-KB Level 2 cache, 667-MHz front-side bus
(FSB) for use in the People's Republic of China
625688-001
Includes Intel Atom N550 1.50-GHz processor, 512-KB Level 2 cache, 667-MHz front-side bus
(FSB)
625689-001
Includes Intel Atom N455 1.66-GHz processor, 512-KB Level 2 cache, 667-MHz front-side bus
(FSB) for use in the People's Republic of China and Russia
626582-001
Includes Intel Atom N475 1.83-GHz processor, 512-KB Level 2 cache, 667-MHz front-side bus
(FSB) for use in the People's Republic of China and Russia
626583–001
Includes Intel Atom N550 1.50-GHz processor, 512-KB Level 2 cache, 667-MHz front-side bus
(FSB) for use in the People's Republic of China and Russia
626584–001
Before removing the system board:
1. Shut down the device. If you are unsure whether the device is off or in Hibernation, turn the
device on, and then shut it down through the operating system.
2. Disconnect all external devices connected to the device.
3. Disconnect the power from the device by first disconnecting the power cord from the AC outlet
and then disconnecting the AC adapter from the device.
4. Remove the battery (see
Battery on page 38).
5. If your device has WWAN capability, remove the SIM (see
SIM on page 39).
6. Remove the following components:
a. Keyboard (see
Keyboard on page 43)
b. Hard drive (see
Mass storage devices on page 50)
c. Top cover (see
Top cover on page 56)
d. Display assembly (see
Display assembly on page 65)
When replacing the system board, be sure that the following components are removed from the
defective system board and installed on the replacement system board:
WLAN module (see
WLAN module on page 53)
WWAN module, if included (see
WWAN module on page 60)
Bluetooth module (see
Bluetooth module on page 63)
74 Chapter 4 Removal and replacement procedures
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