System Configuration
System ConfigurationSystem Configuration
System Configuration
(High-end)
(High-end)(High-end)
(High-end)
Processor Info
Processor InfoProcessor Info
Processor Info
Intel Xeon E3-1280 3.5 GHz
Memory Info
Memory InfoMemory Info
Memory Info
4 x 4GB DDR3 1333 MHz
Graphics Info
Graphics InfoGraphics Info
Graphics Info
NVIDIA Quadro 600
Disks/Optical/Floppy
Disks/Optical/FloppyDisks/Optical/Floppy
Disks/Optical/Floppy
2 x 300GB 10K rpm SATA/ DVD-ROM
Declared Noise Emissions
Declared Noise EmissionsDeclared Noise Emissions
Declared Noise Emissions
(in accordance with ISO
7779 and ISO 9296)
Sound Power
Sound PowerSound Power
Sound Power
(LWAd, bels)
Desktop operator Sound Pressure
Desktop operator Sound PressureDesktop operator Sound Pressure
Desktop operator Sound Pressure
(LpAm, decibels)
Idle
IdleIdle
Idle
3.6 Bels
27 dB
Hard drive Operating
Hard drive OperatingHard drive Operating
Hard drive Operating
(random reads)
4.0 Bels
30 dB
DVD-ROM Operating
DVD-ROM OperatingDVD-ROM Operating
DVD-ROM Operating
(sequential reads)
5.0 Bels
40 db
Environmental
EnvironmentalEnvironmental
Environmental
Requirements
RequirementsRequirements
Requirements
Temperature
TemperatureTemperature
Temperature
Operating: 40° to 95° F (5° to 35° C)
Non-operating: -40° to 140° F (-40° to 60° C)
Humidity
HumidityHumidity
Humidity
Operating: 8% to 85% RH, non-condensing
Non-operating: 8% to 90% RH, non-condensing
Maximum Altitude
Maximum AltitudeMaximum Altitude
Maximum Altitude
Operating: 10,000 feet (3,000 m)
Non-operating: 30,000 feet (9,100 m)
Dynamic
DynamicDynamic
Dynamic
(new)
Shock
Operating: ½-sine: 40g, 2-3ms
Non-operating:
½-sine: 160 cm/s, 2-3ms (~100g)
square: 422 cm/s, 20g
Vibration
Operating random: 0.5g (rms), 5-300 Hz
Non-operating random: 2.0g (rms), 10-500 Hz
NOTE:
NOTE:NOTE:
NOTE:
Values represent individual shock events and do not indicate
repetitive shock events.Values do not indicate continuous vibration.
Cooling
CoolingCooling
Cooling
Above 5,000 ft (1524 m) altitude, maximum operating temperature is de-
rated by 1.8° F (1° C) per 1,000 ft (305 m) elevation increase
Physical Security and Serviceability
Physical Security and ServiceabilityPhysical Security and Serviceability
Physical Security and Serviceability
Access Panel
Access PanelAccess Panel
Access Panel
Tool-less
Includes system board and memory information
Expansion Cards
Expansion CardsExpansion Cards
Expansion Cards
Tool-less
Processor Socket
Processor SocketProcessor Socket
Processor Socket
Tool-less, except for the processor heatsink.
Green User Touch Points
Green User Touch PointsGreen User Touch Points
Green User Touch Points
Yes, on tool-free internal chassis mechanisms
Color-coordinated Cables
Color-coordinated CablesColor-coordinated Cables
Color-coordinated Cables
and Connectors
and Connectorsand Connectors
and Connectors
Yes
Memory
MemoryMemory
Memory
Tool-less
System Board
System BoardSystem Board
System Board
Screw-In
QuickSpecs
HP Z210 SFF Workstation
HP Z210 SFF WorkstationHP Z210 SFF Workstation
HP Z210 SFF Workstation
System Technical Specifications
DA - 13873 Worldwide — Version 8 — July 21, 2011
Page 18
(5 pages)
(164 pages)
(114 pages)
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