HP TouchSmart Technical Information Page 73

  • Download
  • Add to my manuals
  • Print
  • Page
    / 121
  • Table of contents
  • BOOKMARKS
  • Rated. / 5. Based on customer reviews
Page view 72
3. Remove the fan/heat sink assembly (3).
NOTE: Due to the adhesive quality of the thermal material located between the fan/heat sink
assembly and system board components, it may be necessary to move the fan/heat sink assembly
from side to side to detach the assembly.
NOTE: The thermal material should be thoroughly cleaned from the surfaces of the fan/heat sink
assembly (1) and the system board components (2) each time the fan/heat sink assembly is removed.
Replacement thermal material is included with all system board, fan/heat sink assembly, and processor
spare part kits.
Reverse this procedure to install the fan/heat sink assembly.
Component replacement procedures 65
Page view 72
1 2 ... 68 69 70 71 72 73 74 75 76 77 78 ... 120 121

Comments to this Manuals

No comments