HP LK585LT Datasheet download pdf (Page 31)

Technical Reference Guide www.hp.com 3-3

Processor/Memory Subsystem

3.2.2 Processor Changing/Upgrading

These systems use the LGA1155 ZIF (H2) mounting socket and require that the processor use an

integrated heatsink/fan assembly. A replacement processor must use the same type heatsink/fan

assembly as the original to ensure proper cooling. The heatsink and attachment mechanism are

designed to provide maximum heat transfer from the processor component.

CAUTION: Attachment of the heatsink to the processor is critical on these systems. Improper

attachment of the heatsink will likely result in a thermal condition. Although the system is designed to

detect thermal conditions and automatically shut down, such a condition could still result in damage to

the processor component. Refer to the applicable Maintenance and Service Guide for processor

installation instructions.

CAUTION: The CMT, MT, and SFF form factors can support a processor with a thermal design point

(TDP) of up to 95 watts. The USDT form factor can support a processor with a TDP of up to 65 watts.

Exceeding these limits can result in system damage and lost data.

1 2 ... 26 27 28 29 30 31 32 33 34 35 36 ... 113 114

No comments

HP LK585LT Datasheet Page 31