HP Pro 3380 Specifications Page 60
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NOTE: The system will not operate properly if you install unsupported DIMMs.
Populating DIMM Sockets
Populate the DIMM sockets in the following order: XMM1, XMM3
The system will automatically operate in single channel mode, dual channel mode, or flex mode,
depending on how the DIMMs are installed.
●
The system will operate in single channel mode if the DIMM sockets are populated in one
channel only.
●
The system will operate in a higher-performing dual channel mode if the total memory capacity
of the DIMMs in Channel A is equal to the total memory capacity of the DIMMs in Channel B.
The technology and device width can vary between the channels. If Channel A is populated with
one 1-GB DIMM and Channel B is populated with one 2-GB DIMM, the system will operate in
dual channel mode.
●
The system will operate in flex mode if the total memory capacity of the DIMMs in Channel A is
not equal to the total memory capacity of the DIMMs in Channel B. In flex mode, the channel
populated with the least amount of memory describes the total amount of memory assigned to
dual channel and the remainder is assigned to single channel. For optimal speed, the channels
should be balanced so that the largest amount of memory is spread between the two channels.
If one channel will have more memory than the other, the larger amount should be assigned to
Channel A. If you are populating the sockets with one 2-GB DIMM, and one 1-GB DIMM,
Channel A should be populated with the 2-GB DIMM, and Channel B should be populated with
the 1-GB DIMM. With this configuration, 2 GB will run as dual channel and 1 GB will run as
single channel.
●
In any mode, the maximum operational speed is determined by the slowest DIMM in the system.
The system will automatically operate in single channel mode, dual channel mode, or flex mode,
depending on how the DIMMs are installed.
Removing Memory Modules
CAUTION: You must disconnect the power cord and wait approximately 30 seconds for the power
to drain before adding or removing memory modules. Regardless of the power-on state, voltage is
always supplied to the memory modules as long as the computer is plugged into an active AC outlet.
Adding or removing memory modules while voltage is present may cause irreparable damage to the
memory modules or system board.
The memory module sockets have gold-plated metal contacts. When upgrading the memory, it is
important to use memory modules with gold-plated metal contacts to prevent corrosion and/or
oxidation resulting from having incompatible metals in contact with each other.
Static electricity can damage the electronic components of the computer or optional cards. Before
beginning these procedures, ensure that you are discharged of static electricity by briefly touching a
grounded metal object.
When handling a memory module, be careful not to touch any of the contacts. Doing so may damage
the module.
1. Prepare the computer for disassembly (Preparation for Disassembly on page 42).
2. Remove the access panel (
Access Panel on page 43).
50 Chapter 7 Removal and Replacement Procedures – Microtower (MT) Chassis
- HP Pro 3330/3380 Microtower 1
- HP Pro 3335/3385 Microtower 1
- HP Pro 3340/3348 Microtower 1
- HP Pro 3330 Small Form Factor 1
- About This Book 3
- Table of contents 5
- 1 Product Features 11
- Feature Overview 12
- Microtower Components 13
- Small Form Factor Components 14
- Software 15
- Protecting the Software 16
- Computer Setup—File 19
- Computer Setup—Storage 20
- Computer Setup—Security 22
- Computer Setup—Power 25
- Computer Setup—Advanced 26
- 4 Illustrated parts catalog 28
- Misc Parts 32
- Misc Boards 33
- Computer major components 36
- SATA Hard Drives 43
- SATA Hard Drive Cables 43
- SMART ATA Drives 44
- Hard Drive Capacities 44
- Preparation 45
- Grounding the Work Area 47
- Operating Guidelines 48
- Routine Care 48
- Cleaning the Keyboard 49
- Cleaning the Monitor 49
- Service Considerations 50
- Cables and Connectors 51
- Hard Drives 51
- Lithium Coin Cell Battery 51
- – Microtower (MT) Chassis 52
- Removing Memory Modules 60
- Expansion Cards 63
- Item Description 64
- PCI1 PCI slot 65
- PCI2 PCI slot 65
- Installing Additional Drives 74
- Drives 65 75
- Removing an Optical Drive 77
- Removing a Hard Drive 80
- Drives 71 81
- Drives 73 83
- Power Switch/LED Assembly 89
- System Fan 91
- Fan Sink Assembly 95
- AMD Sempron processor: 97
- System Board 101
- Preparation for Disassembly 104
- Access Panel 105
- Front Bezel 107
- DDR3-SDRAM DIMMs 108
- Populating DIMM Sockets 109
- Removing DIMMs 110
- Expansion Card 113
- Cable Management 117
- Cable Connections 118
- Drive Positions 119
- Removing Drives 120
- Removing the Hard Drive 122
- Drives 113 123
- Drives 115 125
- Power Switch 126
- Front USB Assembly 128
- Description Spare part number 130
- Speaker 666885-001 130
- Fan Assembly 132
- Fan Assembly 123 133
- Fan Sink 134
- Processor 136
- Power Supply 138
- Power Supply 129 139
- A Connector Pin Assignments 144
- Headphone 145
- Line-in Audio 145
- Line-out Audio 145
- 4-Pin Power (for CPU) 145
- DVI Connector 147
- 24-Pin Power 148
- PCI Express 149
- B Power Cord Set Requirements 151
- Country-Specific Requirements 152
- C POST Error Messages 153
- Audible Codes 162
- Safety and Comfort 166
- Helpful Hints 167
- Solving General Problems 169
- Solving General Problems 161 171
- Solving Power Problems 172
- Solving Diskette Problems 173
- Solving Diskette Problems 165 175
- Solving Hard Drive Problems 176
- Solving Display Problems 181
- Solving Display Problems 173 183
- Solving Audio Problems 185
- Solving Printer Problems 187
- Solving Network Problems 191
- Solving Network Problems 183 193
- Solving Memory Problems 195
- Solving Processor Problems 196
- Solving Software Problems 203
- Contacting Customer Support 204
- Resetting the Password Jumper 206
- F Backup and Recovery 208
- Performing a Recovery 210
- Using F11 211
- G Specifications 213
- SFF Specifications 214
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